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Integrated Circuits (ICs)
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Connectors
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Discrete Semiconductors
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Capacitors
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Sensors
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- Ultrasonic Receivers
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- Resistors
- Isolators
- Board Mount Poser Supplies
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RF/IF & RFID
- RF/IF & RFID
- Attenuators
- Balun
- RF Accessories
- RF Amplifiers
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- RF Front End
- RF Misc ICs and Modules
- RF Mixers
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- RF Transmitter
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- RFI & EMI Contacts
- RFI & EMI Materials
- RFID Accessories
- RFID Antennas
- RFID Boards
- RFID ICs
- RFID Reader Modules
- RFID Tags
- Circuit Protection
- Crystals
- Inductors
- Filters
Thermal Management
Img
|
Part Number |
Manufacturers
|
Desc
|
In Stock
|
Packing
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Rfq |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK
|
974 |
TO-5 |
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Wakefield-Vette |
WAKEFIELD SOLUTIONS 242-125ABE-22 HEAT SINK
|
743 |
TO-220 |
|
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|
|
CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 38
|
675 |
- |
|
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|
|
CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63
|
130 |
- |
|
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|
|
CUI Devices |
HEATSINK TO-220 2.3W ALUMINUM
|
571 |
- |
|
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|
|
CUI Devices |
HEAT SINK, EXTRUSION,TO-218, 31.
|
216 |
- |
|
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|
|
CUI Devices |
HEATSINK TO-220 4.4W ALUMINUM
|
973 |
- |
|
||||||||||||||||||||||||
|
|
Aavid, Thermal Division of Boyd Corporation |
Heat Sink Passive TO-218/TO-247 Radial Thru-Hole 11C/W Black Anodized
|
676 |
Radial |
|
||||||||||||||||||||||||
|
|
CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50
|
361 |
- |
|
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|
CUI Devices |
HEAT SINK, EXTRUSION,TO-218, 50.
|
803 |
- |
|
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|
|
Wakefield-Vette |
WAKEFIELD SOLUTIONS - 624-60AB - HEAT SINK
|
382 |
BGA |
|
||||||||||||||||||||||||
|
|
Aavid, Thermal Division of Boyd Corporation |
Heat Sink Passive TO-218 Solder Pin 16.8C/W Black Anodized
|
305 |
TO-218 |
|
||||||||||||||||||||||||
|
|
CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50
|
457 |
- |
|
||||||||||||||||||||||||
|
|
Wakefield-Vette |
Heat Sinks TO-220 Package 19.70 C/W Thermal
|
211 |
TO-220 |
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|
CUI Devices |
HEATSINK TO-220 3.9W ALUMINUM
|
530 |
- |
|
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|
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK
|
351 |
Radial |
|
||||||||||||||||||||||||
|
|
CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 38
|
189 |
- |
|
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|
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Aavid, Thermal Division of Boyd Corporation |
Heat Sinks BLK HEAT SINK DIP-28
|
929 |
- |
|
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Wakefield-Vette |
HEATSINK FOR 21MM BGA
|
230 |
BGA |
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|
CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50
|
888 |
- |
|
||||||||||||||||||||||||
|
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK
|
711 |
TO-218 |
|
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|
|
Aavid, Thermal Division of Boyd Corporation |
Heat Sinks TO-220 38.10X34.92 BLACK ANODIZE
|
826 |
Radial |
|
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Wakefield-Vette |
HEATSINK CPU 21MM SQ
|
835 |
- |
|
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|
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Wakefield-Vette |
Heat Sinks 28MM HEATSINK 624 SERIES
|
828 |
BGA |
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|
Wakefield-Vette |
Heat Sinks T0220 FOLDED FIN H/S 24.13x48.26x49.53 mm
|
634 |
TO-220 |
|
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|
|
Advanced Thermal Solutions Inc. |
HEATSINK 45.00MM X 45.00MM ALUM
|
592 |
- |
|
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|
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Advanced Thermal Solutions Inc. |
HEATSINK 60X60X15MM XCUT T766
|
112 |
- |
|
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|
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Advanced Thermal Solutions Inc. |
HEATSINK 60X60X15MM XCUT T766
|
188 |
- |
|
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|
|
Advanced Thermal Solutions Inc. |
HEATSINK 45X45X35MM L-TAB T766
|
766 |
- |
|
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|
|
Advanced Thermal Solutions Inc. |
HEATSINK 45X45X35MM R-TAB T766
|
270 |
- |
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